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第三代
半導(dǎo)體測試家族
Third generation semiconductor testing family
 
Prober

Suitable for automatic probe testing of wafers such as 6 and 8″ Si and SiC discrete devices, power devices, integrated circuits, radio frequency devices, optical chips, etc. Automatic loading and unloading, Wafer ID reading. Fully automatic CCD visual n



Suspended power supply

Multiple sites in parallel

Multi-channel high precision

Supports multiple extensions

Model Prober
Product introduction Suitable for automatic probe testing of wafers such as 6 and 8″ Si and SiC discrete devices, power devices, integrated circuits, radio frequency devices, optical chips, etc. Automatic loading and unloading, Wafer ID reading.
Features ? Fully automatic CCD visual needle positioning.
? High-precision positioning platform.
? Support normal high temperature testing.
? Generate Mapping display Bin in real time.
? Universal GPIB, TTL, R-232 interface.


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